HeiTech Padu secures RM19.9 mil contract

HEITECH Padu Bhd has secured a RM19.9 mil contract for supplying, delivering, installing, testing, integrating and commissioning of hardware and software upgrade to strengthen core business application at the National Registration Department (JPN).

HeiTech Padu said the 24-month contract will commence on May 1.

In a filing with Bursa Malaysia today, HeiTech Padu said the contract is expected to have positive effects on its future earnings and earnings per share.

“Nevertheless, the contract will have no material effect on the dividend policy, share capital and substantial shareholdings of the company for the financial year ending Dec 31, 2020,” it said. — April 22, 2020, Bernama

Subscribe and get top news delivered to your Inbox everyday for FREE